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Thermal bonding technology of thermal compound machine
Release time:
2018-08-01
Thermal bonding is the most widely used form of bonding. Depending on the bonding material, heating to a higher temperature is usually required. Thermal bonding can provide better bonding performance, and the bonded products are more wear-resistant and not easy to crack. The method of thermal bonding is suitable for materials that are not affected by heat. Cold bonding is mainly a method of applying external pressure to bond the bonded films together through pressure-sensitive adhesive. Cold bonding is mainly suitable for the bonding of heat-sensitive materials. For example, the ink of some inkjet printers will melt when heated, and some printers use thermal paper to print. In these cases, the use of a cold bonding machine is the best choice.
Thermal bonding is the most widely used form of bonding. Depending on the bonding material, heating to a higher temperature is usually required. Thermal bonding can provide better bonding performance, and the bonded products are more wear-resistant and not easy to crack. The method of thermal bonding is suitable for materials that are not affected by heat.
Cold bonding is mainly a method of applying external pressure to bond the bonded films together through pressure-sensitive adhesive. Cold bonding is mainly suitable for the bonding of heat-sensitive materials. For example, the ink of some inkjet printers will melt when heated, and some printers use thermal paper to print. In these cases, the use of a cold bonding machine is the best choice.
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